Experimental analysis of a compact cooling system containing an enhanced-surface spray heat sink

Marcus Vinicius P. Carneiro, Andre Provensi, Julio Cesar A. Ferreira, Pedro Cavicchioli,Milton Pereira,Jader R. Barbosa Jr

EXPERIMENTAL THERMAL AND FLUID SCIENCE(2024)

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摘要
This paper examines the performance of a heat sink that combines an evaporator and an expansion device into a single component within a compact vapor compression refrigeration system designed for applications with high heat fluxes. The liquid refrigerant at high pressure expands through orifices, generating a spray that impacts a copper heater. The heated surface is enhanced with laser-micromachined micropillars featuring a square cross-section to improve the thermal conductance of the boiling liquid film. Qualitative evaluations of the enhanced surfaces using interferometry analyses determined the heat transfer surface area and assessed the effectiveness of the fabrication technique. The experiments involved using R-134a, a two-orifice expansion device, and enhanced surfaces with pillar edge sizes ranging from 200 to 600 mu m. This analysis encompasses the cooling system's thermodynamic performance, including compressor power and coefficient of performance, as well as steady-state heat transfer parameters such as convection coefficient and critical heat flux. The system achieved a cooling capacity of 230 W (35.9 W/cm2), with the heater surface temperature staying below 22.9 degrees C and the highest average heat transfer coefficient reaching as high as 55 kW/(m2-K). This represents a 129% increase in thermal conductance compared to mirror polished surfaces, leading to a significant reduction in the temperature of the heated surface. Additionally, the area-corrected heat transfer coefficient is computed to verify the thermal resistance reduction unrelated to the surface area enhancement, and a 60% reduction is found. Furthermore, although this heat transfer enhancement shows minor to no influence on the thermodynamic performance of the refrigeration system, the heater cooling efficiency, defined as the ratio of the enthalpy rise delivered by the heat source to its ideal maximum, increased by 13%. The findings are supported by high-speed video sequences illustrating the boiling heat transfer features.
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关键词
Electronics cooling,Spray cooling,Refrigeration system,Enhanced surfaces
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