3D IC Integration Using Blockchain

Three-dimensional (3D) integrated circuit (IC) contains multiple layers with active devices, to intensely improve the chip performance, device density, and functionality facilitates various industrial applications. However, power and security in 3D IC is still poor due to inefficient placement and routing. To overwhelm these issues, we proposed BlockSec-3DIC method in 3D IC environment. The proposed work has four consecutive phases such as netlist protection, Trojan detection, placement and routing, and dynamic IC validation. In first process, we design a 3D IC with netlist preparation that is synthesized from the HDL codes, for that we proposed four Q-curve algorithm. All the transactions are hashed and stored the blockchain using secure hashing algorithm 3 (SHA-3). In second process, the netlists are analyzed for detecting Trojans by considering gate-level and chip-level features using bi-featured gated recurrent neural network (BF-GRU). In third process, we proposed jellyfish search algorithm (JSA) for optimal placement by considering wire length, average distance, and power consumption. And multi-weighted sum model (MSWM) is proposed for optimal routing by considering distance and thermal factor. Trojan-free netlist placement and routing is performed for enhancing the performance and reducing the power consumption. In final process, we proposed hidden Markov model-based validation (HMM-Valid) for validating the trustworthiness of the IC using the signature. The simulation is conducted using MatlabR2020a that evaluates the performance in terms of attack detection rate, netlist change rate, power consumption, time consumption, area, and wire length.