Challenges for Enabling Multiple High-Speed Interfaces On A Reference Validation Platform

Esha Kondapuram,Chong-Jin Ong,Benjamin Silva, Brandon Lambacher

2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)(2022)

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摘要
For a product to be validated with all use cases, several reference designs would be required. This would increase the overall cost and time to market the product. A single reference validation platform solution with limited routing layers utilizing hardware configurable topology options was developed to enable validation. A single High-Speed IO interface was configurable to allow for the validation of three different platform configurations. This paper discusses the signal integrity challenges like interfaces violating the platform design guidelines, includes review of validation data, and review of the mitigation plans for a successfully validated platform.
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