Workflows for assessing electronic devices with 3D X-ray microscopy and nanoscale computed tomography

Modern 2D and 3D X-ray technologies are among the most useful non-destructive testing (NDT) methods that allow inspection of an object’s internal features without cutting or disassembling a sample. This paper presents workflows that combine 3D X-ray microscopy and nanoscale tomography to generate a detailed three-dimensional visualization of the interior of electronic devices and assemblies, without destroying them, to enable the study of internal components for failure analysis (FA). These imaging workflows can be run independently or complementary to other multiscale correlative microscopy evaluations and provide valuable insights into the inner workings of electronic packages and integrated circuits at multiple length scales, from macroscopic features on electronic devices (i.e., hundreds of mm) to microscopic details in electronic components (in the tens of nm). Understanding advanced electronic systems through X-ray imaging, possibly complemented with additional correlative microscopy investigations, can speed development time, increase cost efficiency, and simplify FA and quality inspection of semiconductor packaging, printed circuit boards (PCBs), and electronic devices assembled with new emerging technologies.