Comprehensive Study of Endurance Fatigue in the Scaled Si FeFET by in-situ Vth Measurement and Endurance Enhancement Strategy
2023 IEEE International Memory Workshop (IMW)(2023)
摘要
The endurance degradation mechanism in Si FeFET has attracted great research interest. However, the reports mainly focused on large-scale devices, owing to the external current measurement limitations of modern equipment. In this work, we study the endurance degradation mechanism in the scaled n-FeFET by in-situ V
th
measurement to overcome the size limitation. We find that excess electron injection rather than hole injection plays a key role in the charge trapping behavior. As the endurance cycles increase, the V
th
after the program pulse positively shifts due to less electron de-trapping. The V
th
after erase pulse negatively shifts due to more hole trapping when the V
g
changes from -1V to -4V and no hole de-trapping occurs when the V
g
changes from -4V to 0 V. The donor trap generation and hole trapping are the dominant factors of endurance failure in the scaled nFeFET.
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关键词
Si-FeFET,Endurance Fatigue,Charge Trapping/De-trapping
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