Editorial: Emerging chip materials and devices for post Moore's era

Frontiers in Materials（2023）

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摘要

EDITORIAL article Front. Mater., 13 June 2023Sec. Semiconducting Materials and Devices Volume 10 - 2023 | https://doi.org/10.3389/fmats.2023.1224537

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关键词

layered semiconductors,lateral epitaxial heterojunctions,integrated biochips,3D integration,sensor,interconnect materials

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