Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering
IEEE Transactions on Device and Materials Reliability（2023）
关键词
Adhesion layers,aging,aluminum nitride heat sink,delamination,interfaces,power modules,silver sintering,thermal cycles,reliability
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要