Sustainable Wood-Waste-Based Thermal Insulation Foam for Building Energy Efficiency

Wood is one of the most abundant biomaterials on Earth, which has been used for centuries in construction applications including furniture, roofing, flooring, and cabinetry. However, wood chips-which are a low-quality and plentiful waste byproduct of lumber milling, woodworking, and shipping operations-have low economic value and complicated disposal methods. In this paper, we propose a strategy for wood chip reuse through the fabrication of bio-based building insulation foam. Through a high-temperature chemical treatment delignification process, we introduced additional small pores within the wood chips, effectively lowering their thermal conductivity, and used them in combination with a binding agent to produce a porous insulation foam. The porous insulation foam achieved a low thermal conductivity of 0.038 W/(mGreek ano teleiaK) and a high compressive strength of 1.1 MPa (70% strain). These characteristics demonstrate that wood waste can be repurposed into an effective building material, addressing challenges in both waste management and sustainable construction.