A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit.

Anirban Samanta,Po-Hsuan Chang,Peng Yan,Mingye Fu,Mehmet Berkay On,Ankur Kumar,Hyungryul Kang,Il-Min Yi,Dedeepya Annabattuni,Yu Zhang,David Scott,Robert Patti,Yang-Hang Fan,Yuanming Zhu,Samuel Palermo,S. J. Ben Yoo

OFC（2023）

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Abstract

We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI ^® ) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency.

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Key words

bit link energy efficiency,direct bond interconnect 3D cointegrated silicon-photonic transceiver,electronic-photonic codesigned transceiver circuit heterogeneously 3D cointegration,FinFET,OMA sensitivity,SerDes

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