A Study of Underfill Dispensing Patterns in Flip-Chip Packaging
2023 International Conference on Electronics Packaging (ICEP)（2023）
Abstract
In view of the continuous growth of digital-twin in the technology and industry in recent years, this study conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.
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Key words
underfill dispensing,flip-chip packaging,filling time efficiency,void formation
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