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Towards a Universal Model of Dielectric Breakdown

2023 IEEE International Reliability Physics Symposium (IRPS)(2023)

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Abstract
We present a microscopic breakdown (BD) model in which chemical bonds are weakened by carrier injection and trapping into pre-existing structural defects (precursors) and by the electric field. The model goes much beyond the existing ones by consistently explaining the role of both current (a weakness of the E model) and temperature (a weakness of the power-law model), along with the role of the electric field. It also explains the non-Arrhenius temperature dependence of BD. It suggests a new comprehensive physics-based framework (with tight connections to material properties) reconciling the many breakdown theories proposed so far (E, power-law, 1/E,…) within a more universal breakdown model.
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Key words
Dielectric Breakdown,Ginestra®,bond-breakage,precursors,carriers' injection
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