引线键合尾丝控制分析及解决方法
Electronics Process Technology(2023)
Abstract
引线键合技术是微电子元器件封装工艺流程中的关键工序,是后道封装工艺中电气互连的主要工艺手段.针对高密度精密键合工艺要求,通过全自动引线键合机的送丝机构、键合劈刀结构、焊接参数和断丝工艺参数等四个方面进行尾丝的形成分析,并在全自动引线键合机上进行楔形键合,最终得到形貌良好的键合焊点.
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Key words
wire bonding,wedge bonding,tail wire,fully automatic wire bonder
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