Removal of Macro Aluminum Defects on Wafer Backside

Advanced technology nodes require minimal defect density at every processing step. Wafer backside uniformity has become increasingly critical in modern high volume semiconductor manufacturing. Improvement in wafer backside cleans can benefit yield, defect reduction, and prevent expensive tool aborts. Backside defectivity not only poses a threat to high volume production but also increases scrap risk further downstream. In this paper, we present an effective backside wet cleans method in a single wafer clean toolset to remove Aluminum backside defects.