MechSense: A Design and Fabrication Pipeline for Integrating Rotary Encoders into 3D Printed Mechanisms

Marwa AlAlawi,Noah Pacik-Nelson,Junyi Zhu,Ben Greenspan, Andrew Doan, Brandon Wong, Benjamin Owen-Block, Shanti Mickens, Wilhelm Schoeman,Michael Wessely,Andreea Danielescu,Stefanie Mueller

CHI 2023(2023)

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摘要
We introduce MechSense, 3D-printed rotary encoders that can be fabricated in one pass alongside rotational mechanisms, and report on their angular position, direction of rotation, and speed. MechSense encoders utilize capacitive sensing by integrating a floating capacitor into the rotating element and three capacitive sensor patches in the stationary part of the mechanism. Unlike existing rotary encoders, MechSense does not require manual assembly but can be seamlessly integrated during design and fabrication. Our MechSense editor allows users to integrate the encoder with a rotating mechanism and exports files for 3D-printing. We contribute a sensor topology and a computational model that can compensate for print deviations. Our technical evaluation shows that MechSense can detect the angular position (mean error: 1.4 degree) across multiple prints and rotations, different spacing between sensor patches, and different sizes of sensors. We demonstrate MechSense through three application examples on 3D-printed tools, tangible UIs, and gearboxes.
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关键词
3D printed mechanisms, printed electronics, capacitive sensing
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