Electrically Controlled Reversible Strain Modulation in MoS$_2$ Field-effect Transistors via an Electro-mechanically Coupled Piezoelectric Thin Film

Strain can efficiently modulate the bandgap and carrier mobilities in two-dimensional (2D) materials. Conventional mechanical strain-application methodologies that rely on flexible, patterned or nano-indented substrates are severely limited by low thermal tolerance, lack of tunability and/or poor scalability. Here, we leverage the converse piezoelectric effect to electrically generate and control strain transfer from a piezoelectric thin film to electro-mechanically coupled ultra-thin 2D MoS$_2$. Electrical bias polarity change across the piezoelectric film tunes the nature of strain transferred to MoS$_2$ from compressive $\sim$0.23% to tensile $\sim$0.14% as verified through peak shifts in Raman and photoluminescence spectroscopies and substantiated by density functional theory calculations. The device architecture, built on a silicon substrate, uniquely integrates an MoS$_2$ field-effect transistor on top of a metal-piezoelectric-metal stack enabling strain modulation of transistor drain current 130$\times$, on/off current ratio 150$\times$, and mobility 1.19$\times$ with high precision, reversibility and resolution. Large, tunable tensile (1056) and compressive (-1498) strain gauge factors, easy electrical strain modulation, high thermal tolerance and substrate compatibility make this technique promising for integration with silicon-based CMOS and micro-electro-mechanical systems.