FE-Analysis of Deformation State during a Four-Point Bending Experiment on Soldered MLCCs

The paper will present the results of these numerical studies about the deformation of the PCB. These results are compared to the Four point-bending setup experiment results. The comparison shows that there are differences set up experimental and the simulation results, which are supposed to be caused by the different setup of an experiment like the point of direction of load acting on the PCB, the position of the PCB in the vertical direction about the process-induced residual stresses, due to the numerous thermal steps during the manufacturing of the MLCCs and also the considering the modeling and appropriate boundary conditions in the numerical setup.