Embedded heat pipe SiC interposer for distributed power devices

Passive heat dissipation was a prospective solution to gratify the thermal management requirements of the continuously compact and miniaturized package. In here, we proposed an embedded heat pipe SiC interposer for the distributed power devices. The thermal effects of wick shape and filling ratio were investigated through the established VOF (volume of fluid) models. The hotspots' arrangement was identified by comparing thermal performance with hotspots' placing at 22.5°, 45°, and 90° in the vertical coordinate system. The 45° arrangement was settled by analyzing the effects on refilling path between the evaporation and condensation areas. Profited from the SiC substrate transparency, the embedded thermography visualization platform was deployed to verify the two-phase flow behaviors inside the SiC interposer with various heat fluxes. Through the Infrared imager and non–contact Raman–based thermometry, the heat transfer coefficient (90 kW/m2·°C @ 160 W/cm2), maximum temperature difference (within 2.6 °C @ 160 W/cm2), and the distributed radial and axial thermal resistances (0.167–0.178 °C/W and 0.157–0.163 °C/W) of the SiC interposer were ascertained, respectively. Towards the distributed power devices embedded heat pipe interposer, the substrate material, the wick geometry, the filling ratio, and hotspots’ arrangement need to be comprehensively optimized.