Evolution of phase interface microstructure and its effects on stress rupture property of a 4th generation nickel-based single crystal superalloy after thermal exposure

Lattice constants, phase interface microstructure and stress rupture properties of nickel-based single crystal superalloy after thermally exposed at 1100 °C for different time were investigated using synchrotron radiation diffraction and transmission electron microscopy techniques. The results show that the lattice constants of γ and γ' phase at room temperature decrease and the misfit at room temperature becomes more negative after 200 h exposure, and these parameters remain unchanged after exposure for 500 h. The release of misfit stress during thermal exposure is completed by the transformation from coherent γ/γ' interface to semi-coherent interface as well as the formation of misfit dislocation. The misfit dislocation network generated during thermal exposure is mainly rectangular shape, and its formation process is analyzed in detail. Additionally, it is found that the stress rupture lives decrease obviously after thermal exposure, while the morphology and size of interfacial dislocation network of thermally exposed alloys after rupture are very similar with that of unexposed alloy. The relation of γ' phase morphology and interfacial dislocation network to the stress rupture property deterioration has been discussed.