Interface enhancing strategy for low-temperature bonding of Ag-based nanoalloy

Qiang Jia,Zhongyang Deng, Lei Liu,Hongqiang Zhang,Wengan Wang,Limin Ma,Fu Guo,Guisheng Zou

Materials Letters（2023）

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摘要

•A sandwich structure nanoparticle film is developed for power electronic packaging.•The Ag transition layer provides further driving force for nanoalloy sintering.•The enhancing strategy enables nanoalloy a high reliability die attach material.

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关键词

Laser deposition,Nanoalloy,Interface structure,Sintering,Electronic packaging

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