Impact of thermal coupling effects on the digital and analog figures of merit of UTBB SOI MOSFET pairs

Martin Vanbrabant,Jean-Pierre Raskin,Denis Flandre,Valeriya Kilchytska

Solid-State Electronics（2023）

引用 0|浏览5

暂无评分

摘要

•Thermal coupling effects between side-by-side UTBB FD-SOI nFETs.•Heat originated from a neighbor device operation degrades device characteristics.•Digital and analog figures of merit degraded by this temperature rise.

查看译文

关键词

FD-SOI,UTBB,Thermal-coupling,Self-heating,Harmonic distortion

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要