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Compatibility investigation of liquid tin and tungsten-based capillary porous system under high-density plasma environment

Tungsten(2020)

Cited 10|Views228
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Abstract
The bias voltage-enhanced plasma was utilized to investigate the compatibility of liquid tin and CPS (capillary porous system) in Sichuan University Plasma Surface Interaction (SCU-PSI). Prewetted (through static heating method) and unwetted (without preheating) Sn-CPS were prepared and then irradiated by different bias voltage-driven plasma. In comparison to bare CPS exposed to plasma, the Sn wetted CPS showed slightly internal and external morphology variation after plasma irradiation with + 20 V and − 20 V bias voltage. However, for unwetted Sn-CPS samples, the CPS revealed varying degrees of damage along with a range of bias voltage (0 V to − 16 V), which has not been observed before. It is interesting that there is no obvious surface structure change or damage for bare CPS after the irradiation of plasma and corrosion of liquid tin from other report. The inside mechanism still needs further investigation.
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Key words
Tungsten, Liquid tin, Capillary porous system, Wetting, Plasma, Compatibility
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