Low-dielectric and low-temperature curable fluorinated nano carbon/polyimide composites with 6-aminoquinoline for end capping

One challenge in the high-performance dielectric material of polyimide (PI) is to obtain the excellent comprehensive properties at low curing temperature for advanced IC package. In this work, 6-aminoquinoline (AQL) is introduced through covalent bonds for end capping to obtain a low-temperature curable PI at first. The results demonstrate that with very limited introduce (2.76%) of AQL, the imidization index could reach as high as 1.01 at 200?degrees C. Then, fluorinated nano carbon (FC) is further introduced resulting in the fluorinated nano carbon/polyimide (FCPI) composites, which effectively reduces the dielectric constant (1 wt%, 2.75 @ 1 MHz). Besides, the as-prepared FCPIs also possess excellent thermal property of which FCPI-0.3 exhibited the 5% weight loss temperature of 540?degrees C and the glass transition temperature is also as high as 385?degrees C. Furthermore, the tensile strength of the film is 127 MPa, the elongation at break is around 15.82%, and the Youngs' modulus is about 3.10 GPa proving the superior mechanical property. As a result, the successful preparation of the FCPI nanocomposites not only possess low-temperature curing and low-dielectric performance but also exhibit excellent thermal and mechanical properties, which shows a wide range of application prospects in the field of microelectronics for the advanced electronic package.