Сonnecting MEMS device for BGA components functional testing

Nevlyudov I. Sh., Martynyak R. M.,Palagin V. A., Slobodyan B. S., Razumov-Frizyuk E. A.,Zharikova I. V., Dmytriv M. I., Belyaev A. S.

Tekhnologiya i Konstruirovanie v Elektronnoi Apparature（2012）

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Abstract

Multiprobe сonnecting device for initial and functional check of electronic components with matrix pin balls has been developed. The device ensures nondefect pneumatic pressing of probes against the terminals.

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Key words

BGA/CSP components,multiprobe connecting device,functional testing

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