Hybrid 2D/3D mesh for efficient device simulation of locally deformed cylindrical semiconductor devices

In this work, we propose an efficient method to simulate cylindrical three-dimensional devices which have a locally deformed structure using a hybrid two-dimensional(2D)/three-dimensional(3D) mesh. The entire device is divided into several sub-devices. Each sub-device can have either a 2D mesh or a 3D one. The proposed method is applied to cases with and without structural deformation. It has been numerically demonstrated that the simulation becomes much more efficient with the hybrid 2D/3D mesh, while there is no loss of accuracy.