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Numerical investigation on Sn-rich solder joints failure mode: Effects of the thermomechanical anisotropic performance

Zhao Zhang,Kun Ma,Kang Liang,Fang Dong,Zhengfang Qian,Sheng Liu

Engineering Failure Analysis（2023）

Cited 1|Views13
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Abstract
•Grain orientation has a crucial effect on the fatigue mode of Sn-rich solder joints.•A new failure mode of Sn-rich solder joints in SiP was found.•Traditional fatigue life prediction model for Sn-rich solder joints is questionable.
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Key words
Failure mode,Sn-rich solder joints,Thermal cycle loading,Anisotropic constitutive model
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