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Compliant Thermal Interface Materials Via Introducing Pendent Chains into Polymer Networks for Chip Cooling

Yongdong Wu,Chenxu Zhang,Wendian Tu,Guoping Du,Xiaoliang Zeng,Rong Sun,Yonglun Xu,Linlin Ren

COMPOSITES COMMUNICATIONS（2023）

Cited 13|Views18
Key words
Thermal interface materials,Compliance,Thermal conductivity,Polymer composites
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