Fundamental Study on the Effects of Parameters on Polishing Characteristic Using a Novel MCF Polishing Method

Magnetic field-assisted magnetic compound fluid (MCF) polishing technology is an effective ultra-precision machining method for obtaining high surface quality. However, the service life of MCF slurry will be reduced due to the loss of water (evaporation and splash) during the polishing process. In this work, a novel MCF polishing method was proposed to supply water into MCF slurry conveniently. Firstly, the optimal parameters of experimental setup was determined by using the single factor experiment, and the influences of the processing parameters on the polishing characteristics were investigated. Thereafter, the polishing performance of this novel method was verified by the optimum process test. The main results are summarized as follows. (1) A set of optimal process parameters were obtained as Δ = 1 mm, nc = 500 r/min, r = 4 mm, and nm = 900 r/min. (2) The surface roughness after 25 min polishing was obtained as 5 nm with a reduction rate of 98.88% under the optimal process parameters.