Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.

Symposium on VLSI Technology (VLSI Technology)(2022)

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摘要
The primary purpose of continuously scaling the logic technologies is to exploit an optimum performance in various applications. However, technology scaling options often result in different reliability challenges. In this paper, an active backside (BS) technology with BS contacts is proposed to bring new opportunities to the primary reliability challenges of ESD and LU. The measured and simulated results indicate the benefits for ESD robustness by enhancing the current uniformity and LU immunity by reducing the parasitic bipolar β of ~50%.
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关键词
logic technologies,technology scaling options,BS contacts,ESD robustness,LU immunity,active backside technology,LU reliability,DTCO/STCO
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