Thermal solution for Co-Packaged Optics (CPO) modules

Keiji Matsumoto,Mukta Farooq,John Knickerbocker

2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)（2022）

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摘要

In Co-Packaged Optics (CPO) where optical devices and ICs are attached to a common base substrate, there are requirements to keep the temperature of high-heat-dissipating ICs as low as possible and also to keep the temperature of optical devices constant. We propose two solutions to meet these two requirements and show the effect of two solutions by simulation.

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关键词

Co-Packaged Optics (CPO),thermal coupling,graphite heat spreader,attached slots to a heat spreader

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