An Innovative Customized PCB Surface Printing for Performance Enhancement
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)(2022)
Abstract
In this paper, a novel and effective approach by the innovative customized PCB surface printing was proposed to reduce far-end crosstalk (FEXT) in multiple microstrip lines. A new type of solder mask with higher dielectric constant up to 8, instead of the conventional one with around 4, was developed for PCB surface printing. The test coupons with the proposed customized solder mask are built and validated, and the measured FEXT was significantly reduced. The design strategy with the optimized structures was clearly addressed, and this innovation can effectively enhance the microstrip electrical performance for high-speed application.
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