Advanced Transfer Printing With In-Situ Optical Monitoring for the Integration of Micron-Scale Devices

IEEE Journal of Selected Topics in Quantum Electronics(2023)

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摘要
Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.
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关键词
Integrated optics,optical waveguide components,hybrid integrated circuits,semiconductor device fabrication,transfer printing,photonic integration
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