2D Spectral Transposed Convolutional Neural Network for S-Parameter Predictions

Yiliang Guo,Xingchen Li,Madhavan Swaminathan

2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)（2022）

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摘要

In packaging problems, S-parameter predictions are necessary. Machine learning methods lead to dimensionality related challenges which we address here through spectral trans-posed convolutional neural network using 2D kernels. Results show that Normalized Mean-squared Error (NMSE) dropped 0.002 by using 53.7% of the parameters.

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关键词

microvia interconnection,convolutional neural network,up-sampling

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