Highly Integrated 4 Tbps Silicon Photonic IC for Compute Fabric Connectivity
2022 IEEE SYMPOSIUM ON HIGH-PERFORMANCE INTERCONNECTS (HOTI)(2022)
Abstract
In this work we present the design and performance of a high bandwidth, low power, low latency, and high-density Silicon Photonic integrated circuit (SiPIC) for compute interconnects. The SiPIC has more than 4 Tbps bandwidth over eight standard single mode fiber pairs. Each fiber pair carries eight DWDM transmit and receive channels operating at 32 Gbps NRZ. We integrate all photonic components and functions including lasers, semiconductor optical amplifiers (SOAs), modulators, photodetectors, spot size convertors and V-grooves onto a single silicon die. Device design and performance details are discussed.
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Key words
Silicon Photonics,Optical IO,Die to Die Interconnects,Computer Fabric
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