Equivalent Circuit-Based Coupling Modeling of Double Bond Ribbons Interconnection Variation in Electronic Packaging

A method for modeling the interconnection and signal transmission performance of double bond ribbons with configuration variation has been proposed. Arc interval function parameterization has been used to define the geometry of bond ribbons. The coupling model was created using the equivalent circuit approach, taking into account the mutual coupling between two ribbons. The average relative error of return loss is 9.21%, and the average relative error of insertion loss is 0.23%. The accuracy of the model has been verified, and the envelope interval of the signal transmission performance considering the variation of the interconnection configuration has been calculated.