Design Challenges of Intrachiplet and Interchiplet Interconnection

Chixiao Chen,Jieming Yin,Yarui Peng,Maurizio Palesi,Wenxu Cao,Letian Huang,Amit Kumar Singh,Haocong Zhi,Xiaohang Wang

IEEE Design & Test（2022）

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摘要

This article discusses the challenges in intrachiplet and interchiplet networks, including the need for faster simulation, better architectures, and performance requirements determined by emerging applications.

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关键词

Chiplet,inter- and intra-chiplet interconnection

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