2.5D Heterogeneous Integration for Silicon Photonics Engines in Optical Transceivers

IEEE Journal of Selected Topics in Quantum Electronics(2023)

引用 2|浏览5
暂无评分
摘要
We present our work in the area of heterogeneous optical integration, where separately manufactured electronic components are assembled on to an active silicon photonics interposer to form a higher-level component. This process allows for the integration of components independently designed and optimized from several different technology and foundry platforms onto a common interposer. Heterogeneous integration is essential for manufacturing higher speed and performance components. Higher levels of integration also allow for closer placement of devices which minimizes the parasitic power consumed to compensate for the frequency dependent losses in the interconnect traces.
更多
查看译文
关键词
High-speed optical techniques,Transceivers,Silicon photonics,Wires,Substrates,Adaptive optics,Multichip modules,2,5D integration,heterogeneous integration,photonic integrated circuits,silicon photonics
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要