Adhesion property between low-thermal- expansion poly (benzoxazole-imide) film and ion-implanted copper
CAILIAO GONGCHENG-JOURNAL OF MATERIALS ENGINEERING（2022）
Abstract
Surface modification of poly (benzoxazole-imide) (PI) film was carried out by means of oxygenplasmatreatment.A flexiblecoppercladlaminate (FCCL)wasfabricated using Ni-Crion implantationandelectro-Cu plating process.Controllingtheconstantpressure,theeffectsofsuch treatmentconditionsaspowerandtime weresystematicallyinvestigated onthesurfaceroughness, chemicalcomposition andinterface adhesion with Cu.Itisfoundthatthe opticalparametersfor productionofFCCL withexcellentadhesionandsolderresistanceare50 W/5 minand100 W/10 min, respectively.Suitableroughness,reactiveradicalwithhighcontentpendentoxygengroup,andmetal-oxazolecomplexhelptoendowexceptionaladhesivepropertytotheinterfaceofPI/Cu.Andthepeel strengthofFCCLpreparedfrom PIfilm with such modified surface rises by 60%.
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Key words
benzoxazole,polyimide,ion implantation,flexible cupper clad laminate,peel strength
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