Advantages of the extended finite element method for the analysis of crack propagation in power modules

Kenneth Chimezie Nwanoro,Hua Lu,Chunyan Yin,Chris Bailey

Power Electronic Devices and Components（2023）

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摘要

•XFEM and Level set methods with submodelling has been implemented in this study.•Method easily allows inclusion of crack growth in IGBT wire bond reliability analysis•Bond wire diameter and loop height significantly affect IGBT wire bond reliability.•Wire bond degradation parameter values decrease with increasing crack length.•For similar load density, smaller wire diameter produces longer wire bond lifetime.

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关键词

XFEM,FEA,Wire bond,IGBT power module,Thermal cycling,Computer simulation,Reliability

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