Deep sub-micron Josephson junctions fabricated by using maskless direct writing on 4-inch silicon wafer

Zhi Ni,Guofeng Zhang,Wentao Wu,Yongliang Wang,Liangliang Rong,Jun Wu,Longqing Qiu,Shulin Zhang, Hui Dong,Xiaoming Xie

Physica C: Superconductivity and its Applications（2022）

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摘要

•We have developed a double-over-etching (DOE) process for Nb/Al-AlOx/Nb josephson junctions.•The maskless direct writing lithography (DWL) is adopted for the exposure of the whole 4-inch wafer.•With the combination of DOE and DWL, not only can deep submicron Josephson junctions be realized, but also ten-millimeter-scale patterns (e.g., pickup coil of SQUID) would be integrated in the same wafer.

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关键词

Josephson junction,Deep sub-micron,Maskless,Direct writing lithography

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