Thermokinetic stabilisation of nanocrystalline Cu by ternary approach

Nanocrystalline alloy design with the synergistic contribution of 'thermodynamic' and 'kinetic' stabilisation mechanism leads to much superior microstructural stabilisation at elevated temperatures. Ternary Cu98.5W1Zr0.5 (at. %) alloy, synthesised by mechanical milling under cryogenic temperature followed by consolidation through hot pressing at 550 degrees C, has been examined to access the potential of their concurrence. A meager drop in hardness (similar to 0.5 GPa) confirms the stability of the alloy up to 800 degrees C. The effect of alloy addition has been studied in terms of microstructure alteration, measured by X-ray diffraction, transmission electron microscopy, and Molecular dynamics (MD) simulation. In addition, the shear punch test (SPT) has been employed to assess the mechanical property of the consolidated alloy. Results suggest that the current approach provides a framework en route to designing bulk nanostructured alloys adapting the bottom-up method.