Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding

Koki Onishi,Tomoya Iwata,Hitoshi Habuka,Fuya Nagano,Fumihiro Inoue

2022 International Conference on Electronics Packaging (ICEP)（2022）

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摘要

Low-temperature deposited PE-CVD SiCN has been comprehensively investigated towards the dielectric layer of Die-to-Wafer hybrid bonding. The PECVD SiCN was deposited at room temperature. The characterization of the deposited film and the impact of the plasma activation on the surface has been analyzed.

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关键词

Hybrid bonding,Die-to-Wafer stacking,PE-CVD SiCN

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