Novel plasma process for build-up film in the fine wiring fabrication

The market growing of high performance devices is due not only to the development of semiconductor chips, but also to the dramatic development of packaging technology. In high frequency electronic devices, dielectric layers with low dielectric constant and low loss tangent are desired in order to reduce signal loss. In the production of some devices, the adoption of build-up film is being considered as redistribution layer (RDL) as instead of photosensitive resin. Ajinomoto build-up film (ABF) is build-up film that dominated the market. There are various types of ABF depending on the type of device. The resin type, the size of silica filler, and the occupancy rates of the filler is different. In this paper, the characteristics of dry etching of various ABF and adhesion strength between seed layer and ABF are reported.