Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)(2022)
摘要
Three-dimensional heterogeneous integration is at the core of development for advanced package technology, evolving several applications including mobile, HPCs, and AL In this paper, we have proposed wafer to wafer hybrid bonding by using the solderless nc-Cu and nc-Cu/SiO2 hybrid structure with a pronouncedly reduced bonding temperature of 150 degrees C for 1 hour. The bonding strength was near to 12 J/m(2) between jointed two nc-Cu blanket wafers with an extremely strong bonding interface. For the first time, we have successfully bonded at a low temperature of 150 degrees C, with distinctive materials and composite structures.
更多查看译文
关键词
nanocrystalline copper, low-temperature bonding, wafer-to-wafer, hybrid bonding
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要