Development of Polyimide Base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)(2022)
摘要
A new polyimide-based photosensitive bonding adhesive ("New PI") was developed for 3D hybrid bonding at low temperatures by redesigning key components of the formulation. The New PI was cured at 230 degrees C and bonded at 250 degrees C or less using a conventional flip-chip bonder, showing great potential as a permanent hybrid bonding dielectric material. Furthermore, the advantages of polyimide (PI) in the hybrid bonding process were investigated and it was found to have higher step-absorbing properties compared to inorganic material. It is considered that these properties contribute to a high bonding yield of PI.
更多查看译文
关键词
polyimide,photosensitive,hybrid bonding,chip to wafer bonding,2.5/3D packaging
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要