3D Cryogenic Interposer for Quantum Computing Application

Conventional Cu through silicon via(TSV)(5x50 mu m) with Al metal lines on 300mm Si substrate were fabricated and electrically tested at cryogenic temperatures down to 20mK in a dilution refrigerator to assess their reliability for cryogenic applications. I-V characterization of the Al lines was also performed from room temperature to 20mK to study the superconducting transition tern perature (Tc) of the Al.