Carrier Systems for Collective Die-to-Wafer Bonding
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)(2022)
Abstract
Several alternative carrier systems for collective die-to-wafer transfer, using the laser debonding technique, are evaluated. The principles of laser debonding are explained and applied to thin die transfer. A so called 'acoustic' layer needs to be present to avoid damage to the dies during the laser ablation process. The benefits and disadvantages of applying this layer to the glass carrier system rather than to the dies prior to singulation are explained. Three alternative carrier systems, based on BrewerBOND (R) C1301-50 material and BrewerBOND (R) T1107 release material, are designed and evaluated for die placement, protective layer strip, collective bonding and finally laser debonding. A quantitative analysis and comparison with a reference system containing the release layer and acoustic layer on the die prior to singulation is presented.
MoreTranslated text
Key words
Heterogeneous integration,wafer bonder,dielectric bonding,hybrid bonding,die-to-waftr bonding,temporary bonding material,laser release material,laser debonding,collective hybrid bonding
AI Read Science
Must-Reading Tree
Example
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined