Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)(2022)
摘要
We have studied the hybrid bonding process with a copper (Cu)/polyimide (PI) system by optimizing aqueous acid treatment, height control of Cu protrusion, and temporary/permanent bonding conditions for practical use. The study found that the treatment with an aqueous solution of citric or ascorbic acid and 80 nm-protrusion contributed to the improvement in the bonding yield of Cu electrodes. The suitable temperature and pressure of the permanent bonding were determined at 250 degrees C and 5 MPa, and the mechanically tough junctions for both Cu-Cu and PI-PI interface were successfully achieved with relatively low resistance.
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关键词
hybrid bonding,polyimide,CMP,CoW,3D,2.5D
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