Imaging of buried overlay and alignment markers using picosecond acoustic microscopy
METROLOGY, INSPECTION, AND PROCESS CONTROL XXXVI(2022)
摘要
Optically opaque materials present a series of challenges for alignment and overlay in the lithography process flow. We demonstrate the efficacy of picosecond acoustic microscopy (PAM) in generating 2D lateral images of structures embedded under opaque layers, including the potential of PAM to generate 3D images by analyzing scanned z planes.
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关键词
Picosecond Acoustic Microscopy (PAM), Picosecond Laser Acoustics (PLA), Alignment and overlay target
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