Machining of Silicon Carbide Wafers

Madeline Thompson,Bradley Ferguson,Gregory N. Nielson,Stephen Schultz

2022 Intermountain Engineering, Technology and Computing (IETC)（2022）

Cited 0|Views7

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Abstract

Silicon carbide has many desirable properties that make it a high demand product. Some of these properties make it difficult to machine silicon carbide for industrial use. This work demonstrated the ability to machine silicon carbide using Electrical Discharge Machining, Water Jet Machining, and diamond grinding.

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Key words

Silicon carbide,Wire Electrical Discharge Machining,Abrasive Water Jet Machining,diamond grinding

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