Two-pads per electrode in-situ test structure for micron-scale flip-chip bonding reliability of chip-on-chip device

Arrayed CMOS-MEMS Devices are often made separately, and they are face-to-face flip-chip bonded for electrical connection. We propose an in-situ testing method by “two-pad-per- electrode” design to check the contact of bonding pads, which enables testing bonding contact between production chips and identification of the place of defects.